The Union Cabinet has approved four major semiconductor projects in Odisha, Punjab, and Andhra Pradesh, marking a significant step in India’s push to become a global hub for chip manufacturing. Information & Broadcasting Minister Ashwini Vaishnaw announced on Tuesday that the initiatives, backed by a total investment of Rs 4,594 crore, fall under the India Semiconductor Mission, which has allocated Rs 76,000 crore to foster domestic chip production.

In Odisha, SiCsem Pvt Ltd will establish a silicon carbide semiconductor plant in Bhubaneswar with an investment of Rs 2,066 crore, focusing on advanced chip technology. Another facility in the state will produce 3D Glass semiconductors, supported by a Rs 1,943 crore investment from global giants like Intel and Lockheed Martin, signaling strong international confidence in India’s semiconductor ambitions.

In Andhra Pradesh, Advanced System in Package Technologies Pvt Ltd will set up a chip packaging plant with a Rs 468 crore investment, enhancing India’s capabilities in semiconductor assembly and testing. Meanwhile, Punjab will host a new facility by electronic component manufacturer CDIL, with a Rs 117 crore investment, aimed at boosting local production of critical chip components.

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These projects are expected to create thousands of jobs and position India as a key player in the global semiconductor supply chain. The announcement has generated buzz on platforms like X, with users highlighting the economic and technological potential of the initiatives. As India accelerates its semiconductor ecosystem, these plants mark a pivotal moment in reducing reliance on imports and driving technological self-sufficiency.

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